specification:
• Low-voltage and Standard-voltage Operation – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 3.6V)
• Internally Organized 65,536 x 8
• Two-wire Serial Interface
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V), 400 kHz (2.7V) and 100 kHz (1.8V) Compatibility
• Write Protect Pin for Hardware and Software Data Protection
• 128-byte Page Write Mode (Partial Page Writes Allowed)
• Self-timed Write Cycle (5 ms Max)
• High Reliability – Endurance: 100,000 Write Cycles – Data Retention: 40 Years
• Automotive Devices Available
• 8-lead PDIP, 8-lead EIAJ SOIC, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead LAP, 8-lead SAP and 8-ball dBGA2 Packages
• Die Sales: Wafer Form, Waffle Pack and Bumped Die
